Superhard Nanocrystalline Ti–Cu–N Coatings Deposited by Vacuum arc Evaporation of a Sintered Cathode
Научная публикация
| Общее |
Язык:
Английский,
Жанр:
Статья (Full article),
Статус опубликования:
Опубликована,
Оригинальность:
Оригинальная
|
| Журнал |
Surface and Coatings Technology
ISSN: 0257-8972
, E-ISSN: 1879-3347
|
| Вых. Данные |
Год: 2012,
Том: 207,
Страницы: 430-434
Страниц
: 5
DOI:
10.1016/j.surfcoat.2012.07.037
|
| Ключевые слова |
Nanocrystalline structure, Ti-Cu-N coating, Transmission electron microscopy, Vacuum-arc deposition, X-ray diffraction |
| Авторы |
Ivanov Yu.F.
1
,
Koval N.N.
1
,
Krysina O.V.
1
,
Baumbach T.
2
,
Doyle S.
2
,
Slobodsky T.
2
,
Timchenko N.A.
3
,
Galimov R.M.
3
,
Shmakov A.N.
4
|
| Организации |
| 1 |
Institute of High Current Electronics, SB RAS, 2/3 Akademichesky Ave., Tomsk, 634055, Russia
|
| 2 |
Karlsruhe Institute of Technology (KIT), Institute for Synchrotron Radiation, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
|
| 3 |
National Research Tomsk Polytechnic University, Tomsk 634050, Russia
|
| 4 |
Siberian Synchrotron Radiation Center, Budker Institute of Nuclear Physics, SB RAS, 11 Lavrentyev Ave., Budker INP, Novosibirsk, 630090, Russia
|
|
Experimental data are presented on the structure and properties of hardening nanocrystalline copper-added titanium nitride coatings produced by plasma-assisted vacuum arc evaporation of sintered cathodes. A model of the nanostructurization of this type of coating is proposed. According to the model, the nanocrystallization in these materials is due to the added atoms, which form an amorphous sheath around a grain that restricts the grain growth.