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Method for Manufacturing Silicon X-Ray Masks Via Plasma Chemical Etching Научная публикация

Журнал Journal of Surface Investigation: X-Ray, Synchrotron and Neutron Techniques
ISSN: 1027-4510 , E-ISSN: 1819-7094
Вых. Данные Год: 2020, Том: 14, Номер: 4, Страницы: 862-865 Страниц : 4 DOI: 10.1134/s1027451020040266
Ключевые слова deep X-ray lithography, X-ray masks, LIGA technology
Авторы Gentselev A.N. 1 , Dultsev F.N. 2,3 , Goldenberg B.G. 1 , Kuper K.E. 1
Организации
1 Institute of Nuclear Physics, Siberian Branch, Russian Academy of Sciences
2 Novosibirsk State University
3 Rzhanov Institute of Semiconductor Physics, Siberian Branch, Russian Academy of Sciences

Реферат: A simple method for manufacturing silicon masks for deep X-ray lithography, conducted with the application of exposure radiation of the spectral range (0.5–7 Å), is described. This method is based on planar silicon technology, which is widely used in the production of semiconductor devices. A significant difference between this method and previously known analogues is that it does not apply the creation of a stop layer by doping during formation of the support membrane of the mask. As the initial blank, a standard (100) oriented silicon wafer is used. The silicon support membrane of the mask is formed in the final stage of its manufacture by plasma-chemical etching of the rear-side of the wafer to a predetermined depth. The thus obtained X-ray masks on a silicon wafer are characterized by relative ease of manufacture, radiation and chemical resistance, geometric stability, and relatively high levels of mechanical strength and X-ray transparency of the support membrane, depending on its thickness, which can be manufactured with good accuracy and within a fairly wide range of ~2.5–50 μm, depending on the purpose of the mask
Библиографическая ссылка: Gentselev A.N. , Dultsev F.N. , Goldenberg B.G. , Kuper K.E.
Method for Manufacturing Silicon X-Ray Masks Via Plasma Chemical Etching
Journal of Surface Investigation: X-Ray, Synchrotron and Neutron Techniques. 2020. V.14. N4. P.862-865. DOI: 10.1134/s1027451020040266 WOS Scopus РИНЦ CAPlusCA OpenAlex
Оригинальная: Генцелев А.Н. , Дульцев Ф.Н. , Гольденберг Б.Г. , Купер К.Э.
Способ изготовления кремниевых рентгеношаблонов с использованием плазмохимического травления
Поверхность. Рентгеновские, синхротронные и нейтронные исследования. 2020. №8. С.108-112. DOI: 10.31857/S1028096020080087 РИНЦ OpenAlex
Даты:
Поступила в редакцию: 29 дек. 2019 г.
Принята к публикации: 31 янв. 2020 г.
Опубликована в печати: 1 июл. 2020 г.
Опубликована online: 25 авг. 2020 г.
Идентификаторы БД:
Web of science: WOS:000568081700035
Scopus: 2-s2.0-85089816894
РИНЦ: 45364532
Chemical Abstracts: 2020:1683252
Chemical Abstracts (print): 173:646020
OpenAlex: W3080778559
Цитирование в БД:
БД Цитирований
Scopus 1
OpenAlex 1
Альметрики: