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Chloropolymer Precursor Utilization for the Nanostructured Co-Containing Carbon Layers Formation on Silicon Substrate Full article

Conference Юбилейная научная конференция "XXI век: Химия в жизнь"
24-26 Apr 2019 , Омск
Journal AIP Conference Proceedings
ISSN: 0094-243X , E-ISSN: 1551-7616
Output data Year: 2019, Volume: 2143, Article number : 020016, Pages count : 5 DOI: 10.1063/1.5122915
Authors Krivozubov O.V. 1,2 , Kryazhev Yu.G. 3 , Anikeeva I.V. 3 , Davletkildeev N.A. 1,2 , Sokolov D.V. 2 , Semenova O.N. 1
Affiliations
1 Omsk Research Center of SB RAS, 15 Marksa Pr., Omsk 644024, Russia
2 Dostoevsky Omsk State University, 55 a, Mira Pr., Omsk 644077, Russia
3 Center of New Chemical Technologies BIC, 54, Neftezavodskaya Str., Omsk 644040, Russia

Funding (1)

1 Federal Agency for Scientific Organizations 0363-2016-0001 (II.9.2.1)(АААА-А17-117041210227-8)

Abstract: The possibility of nanostructured Co-containing carbon layers formation by means of the approach based on polyvinyl chloride alkaline dehydrochlorination in dimethyl sulfoxide in the presence of Co-nitrate is shown. From the mentioned reaction mixture, the layers of the carbon polymer precursor – polyvinylene formed during dehydrochlorination were deposited on the silicon wafer by spin coating. The obtained layers heat treatment up to 400 °C results in the formation of Co-carbon nanostructured continuous layers which structure is studied by the atomic force microscopy.
Cite: Krivozubov O.V. , Kryazhev Y.G. , Anikeeva I.V. , Davletkildeev N.A. , Sokolov D.V. , Semenova O.N.
Chloropolymer Precursor Utilization for the Nanostructured Co-Containing Carbon Layers Formation on Silicon Substrate
AIP Conference Proceedings. 2019. V.2143. 020016 :1-5. DOI: 10.1063/1.5122915 WOS Scopus РИНЦ AN OpenAlex publication_identifier_short.sciact_ihcp_identifier_type
Dates:
Published online: Aug 16, 2019
Identifiers:
Web of science: WOS:000505769900016
Scopus: 2-s2.0-85071271183
Elibrary: 41659349
Chemical Abstracts: 2019:2069939
OpenAlex: W2968191115
publication_identifier.sciact_ihcp_identifier_type: 2053
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